Materials News

New resin for ultra-thin film an alternative to PEEK

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The new material expands Solvay's proprietary AvaSpire AV-600 PAEK series. The AvaSpire AV-630 grade can be drawn down in extrusion processes to extremely low thicknesses while also offering significant performance advantages in ultra-thin film (less than 25 micron thickness) versus similar films made from PEEK. These benefits include increased ductility for better puncture resistance, which translates into a more robust handling capability in manufacturing operations.

In addition, AV-630 offers more consistent/uniform mechanical properties along both flow and transverse directions of the film. Manufacturers report that PAEK film feels less crinkly and is slightly more flexible than PEEK film at comparable thicknesses, says the US company.

The new PAEK material also boasts a higher heat deflection temperature (HDT) and enhanced flammability resistance compared to PEEK.

AvaSpire AV-630 is manufactured via Solvay's proprietary melt filtration process, which ensures a clean production with low gel content and other particulate contamination. The material also exhibits improved adhesion to substrate materials during assembly operations.

The new PAEK grade is being evaluated for use at several OEMs in a range of applications such as electrical/electronics, aerospace, medical and industrial sectors. These include capacitors, electrical insulation, flexible circuitry substrates, composite film layers, speciality laminates, moisture barrier liners and aerospace films such as thermal acoustical insulation blanket covering films.

In addition to ultra-thin film and tape, AV-630 is suitable for melt extrusion into monofilaments, thinwall medical tubing and capillaries as well as for melt extrusion-based wire and cable insulation coating.